Microchip’s Advanced Packaging Business delivers a competitive advantage for its customers through miniaturising electronic circuits and enabling wireless connectivity.

With a track record of success in designing and developing miniaturised electronic modules, Microchip’s Advanced Packaging Division is at the heart of mission-critical projects in such applications as pacemakers, neurostimulators, sensors, hearing aids and patient monitoring.

Technology development is underpinned through TSB and FP7 collaborations with leading research organisations and companies where Microchip plays a leading role in management and exploitation. Current projects include energy harvesting, In/On body wireless communications and embedded components to drive the next generation of 3D miniaturisation.